Thermal Characteristics of PCB Laminates used in High Frequency Applications
نویسنده
چکیده
As technology advances, understanding thermal management issues of high frequency PCB’s increases. There are many different aspects to consider for PCB thermal management. This paper will investigate thermal management issues of high frequency PCB’s as it relates to material properties, insertion loss and circuit design configurations. It will be shown that there are many tradeoffs between these aspects which can be very beneficial for the circuit designer to be aware of.
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تاریخ انتشار 2012